 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| INTEGRATED CIRCUITS DATA SHEET UAA2062 Analog cordless telephone IC Product specification File under Integrated Circuits, IC17 2000 Aug 10 Philips Semiconductors Product specification Analog cordless telephone IC FEATURES RF RX (double superheterodyne FM receiver) * Integrated Low Noise Amplifier (LNA) with programmable gain and input impedance * 1st mixer with external filter at 10.7 MHz * 2nd mixer with external filter at 455 or 450 kHz (depending on country application) * FM detector including a fully integrated IF limiter, a wide-band PLL and a Received Signal Strength Indicator (RSSI) output * Carrier Detector (CD) with programmable threshold. RF TX * Buffer driving an internal Power Amplifier (PA) with programmable gain * Narrow-band PLL including VCO * Data transmission summing operational amplifier. Synthesizer * 10.24 or 11.15 MHz crystal reference oscillator (LO2) and reference frequency divider * Programmable TX VCO with phase detector and frequency divider * Programmable RX VCO (LO1) with phase detector and frequency divider * Programmable clock divider with output buffer to drive the microcontroller. Baseband RX section * Programmable RX gain * Expander * Fully integrated earpiece amplifier with fixed gain. ORDERING INFORMATION PACKAGE TYPE NUMBER NAME UAA2062TS SSOP48 DESCRIPTION plastic shrink small outline package; 48 leads; body width 7.5 mm Baseband TX section * Microphone amplifier * Compressor * Programmable TX gain. Microcontroller interface * 3-wire serial interface. Other features UAA2062 * Voltage regulator to supply internal PLLs and the microcontroller * Programmable low-battery detector time multiplexed with RSSI carrier detector. APPLICATIONS * World-wide analog cordless telephone set (CT0). GENERAL DESCRIPTION The UAA2062 is a BiCMOS integrated circuit that performs all functions from the antenna to the microcontroller for reception and transmission for both the base station and the handset in a cordless telephone. This IC integrates most of the functions required for a cordless telephone into a single integrated circuit. The implemented programming enables the device to be used for the CT0 standard in many countries. Additionally, the implemented programming significantly reduces the amount of external components, board space requirements and external adjustments. VERSION SOT370-1 2000 Aug 10 2 Philips Semiconductors Product specification Analog cordless telephone IC BLOCK DIAGRAM handbook, full pagewidth ECAP VCC TXPD UAA2062 1 2 TX PHASE DETECTOR REFERENCE DIVIDER (2048 or 892) 48 Vref(PLL) RX PHASE DETECTOR 47 RXPD TXLF data TX MODO 3 14-BIT TX PROGRAMMABLE DIVIDER LO2 46 PLLGND 14-BIT RX PROGRAMMABLE DIVIDER 45 LO1O RX VCO 44 LO1I 43 RXLF LO1 42 RFI LNA 41 VCC(LNA) 4 MODI 5 VBMOD TXO VCC PAO 6 7 8 PA TX gain BPFI RF TXGND TX mute 40 LO1 BPFI VCC LO3I 9 TX VCO hard limiter x 1st mixer 2nd mixer 39 MX1O 38 RFGND 1st IF filter(1) VREFTX 10 CCAP 11 CMPI 12 MICO 13 microphone amplifier MICI 14 VB VCC(AUTX) 15 REG 3 V VB VB 16 Vref VCC VB CD RSSI VB EN 18 VCC 220 k DATO 21 CLKO LO2O crystal(1) LO2I 22 23 24 CRYSTAL OSCILLATOR LO2 VB DIVIDER DATA 19 CLK 20 MICROCONTROLLER SERIAL INTERFACE expander DATO REG 3 V VB VCO LBD VCC(AU) ECAP RX mute VB VREFTX CCAP compressor RSSI LO2 ALC x 37 MX2O VCC 36 MX2I 35 RSSI 34 LIMI 33 VCC(RF) 2nd IF filter(1) UAA2062 Vref(PLL) VREFTX VBMOD LIM RSSI x LOOP FILTER amplifier 32 PLLO 31 DETO CD/BD CDBDO 17 RX gain 30 RXI data amplifier 29 DATI 28 VCC(AU) earpiece amplifier 27 EARO 26 EARI 25 AUGND FCA120 (1) Values are depending on country application (see definition in Chapter "Channel frequencies"). Fig.1 Block diagram. 2000 Aug 10 3 Philips Semiconductors Product specification Analog cordless telephone IC PINNING SYMBOL ECAP TXPD TXLF MODO MODI TXO PAO TXGND LO3I VREFTX PIN 1 2 3 4 5 6 7 8 9 10 DESCRIPTION output pin for external capacitor from expander phase detector output voltage for TX PLL input from loop filter to TX VCO summing amplifier output voltage summing amplifier inverting input TX baseband output voltage power amplifier output ground for RF TX chain and PA TX VCO input output pin for decoupling capacitor for regulated voltage for TX VCO output pin for external capacitor from compressor compressor input voltage microphone amplifier output voltage microphone amplifier inverting input supply voltage for TX audio internal voltage reference multiplexed output from carrier detector or low-battery detector enable signal for serial interface data signal for serial interface clock signal for serial interface data comparator output output pin for external clock crystal oscillator output Vref(PLL) 48 LO1O PLLGND RXPD 45 46 47 UAA2062 SYMBOL LO2I AUGND EARI EARO VCC(AU) DATI RXI DETO PLLO VCC(RF) LIMI RSSI MX2I MX2O RFGND MX1O BPFI VCC(LNA) RFI RXLF LO1I PIN 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 DESCRIPTION crystal oscillator input ground for audio part earpiece amplifier inverting input earpiece amplifier output voltage supply voltage for audio part data comparator input RX audio input voltage amplifier FM PLL output voltage amplifier FM PLL inverting input supply voltage for RF RX limiter input voltage output pin for external capacitor from RSSI 2nd mixer input 2nd mixer output ground for RF RX 1st mixer output voltage LNA output for external LC supply voltage for LNA LNA input voltage input from loop filter to RX VCO input pin to connect the external LC for RX VCO output pin to connect the external LC for RX VCO ground for digital part of the PLL phase detector output voltage for RX PLL output pin for decoupling capacitor for regulated voltage for internal PLLs and microcontroller CCAP CMPI MICO MICI VCC(AUTX) VB CDBDO EN DATA CLK DATO CLKO LO2O 11 12 13 14 15 16 17 18 19 20 21 22 23 2000 Aug 10 4 Philips Semiconductors Product specification Analog cordless telephone IC UAA2062 handbook, halfpage ECAP 1 TXPD 2 TXLF 3 MODO 4 MODI 5 TXO 6 PAO 7 TXGND 8 LO3I 9 VREFTX 10 CCAP 11 CMPI 12 48 Vref(PLL) 47 RXPD 46 PLLGND 45 LO1O 44 LO1I 43 RXLF 42 RFI 41 VCC(LNA) 40 BPFI 39 MX1O 38 RFGND 37 MX2O UAA2062 MICO 13 MICI 14 VCC(AUTX) 15 VB 16 CDBDO 17 EN 18 DATA 19 CLK 20 DATO 21 CLKO 22 LO2O 23 LO2I 24 FCA091 36 MX2I 35 RSSI 34 LIMI 33 VCC(RF) 32 PLLO 31 DETO 30 RXI 29 DATI 28 VCC(AU) 27 EARO 26 EARI 25 AUGND Fig.2 Pin configuration. 2000 Aug 10 5 Philips Semiconductors Product specification Analog cordless telephone IC FUNCTIONAL DESCRIPTION Power supply and power management POWER SUPPLY VOLTAGE The UAA2062 is used in a cordless telephone handset and in a base unit. The handset unit is battery powered and can operate on three NiCad cells. The minimum supply voltage (VCC) is 3.0 V. However the low-battery detector, crystal oscillator, clock divider and internal voltage regulator will function with a supply voltage of 2.85 V. POWER SAVING OPERATION MODES When the UAA2062 is used in a handset, it is important to reduce the current consumption. There are 3 power saving modes in addition to the active mode: Table 1 Power saving operation modes CIRCUIT BLOCK Microcontroller interface Vref(PLL) Crystal oscillator RF receiver and RX PLL VB reference Carrier and low-battery detectors Data comparator TX PLL and PA RX and TX audio paths Note ACTIVE MODE X X X X X X X X X RX MODE X X X X X X X - - STANDBY MODE X X(1) X - - - - - - UAA2062 1. In the active mode all blocks are powered. 2. In the RX mode, all circuitry in the receiver part is powered. 3. In the standby mode, all circuitry is powered down except the crystal oscillator, the microcontroller interface and the Vref(PLL) block. 4. In the inactive mode, all circuitry is powered down except the microcontroller interface and the Vref(PLL) block. Latch memory is maintained in all modes. Table 1 shows which blocks are powered in each mode. INACTIVE MODE X X(1) - - - - - - - 1. In the standby mode and in the inactive mode, by default, Vref(PLL) remains regulated but is not calibrated (bit VREFPLL disable is logic 0). If bit VREFPLL disable is logic 1, Vref(PLL) is not regulated and fluctuates with VCC. MAXIMUM CURRENT CONSUMPTION Table 2 shows the typical and the maximum current consumption in the active mode and the three current saving modes under the following conditions: IP3 HIGH mode (bit IP3 is logic 1), see Table 6; LNA gain is step 3 (bits LNA are logic 11), see Table 12 and the PA output level is step 3 (bits PA are logic 11), see Table 15. In the standby mode and in the inactive mode, pin Vref(PLL) is not powered (bit VREFPLL disable is logic 1) and the clock output signal is disabled (bits clock divider ratio are logic 00). 2000 Aug 10 6 Philips Semiconductors Product specification Analog cordless telephone IC Table 2 UAA2062 Current consumption in the 4 operating modes (VCC = 3.6 V; Tamb = 25 C); see Table 5 for programming of the power saving operation modes TYPICAL CURRENT CONSUMPTION (mA) 27 11 0.35 0.05 MAXIMUM CURRENT CONSUMPTION (mA) 36 15 0.5 0.1 POWER OPERATING MODE active mode RX mode standby mode inactive mode The FM receiver part FM RECEIVER The FM receiver has the programmability to operate for all country channels, including the 25 U.S. channels, without the need for external switching circuitry (see Fig.3). The gain and input impedance of the LNA are programmable. The LNA also includes a programmable capacitance to avoid external manual fine tuning. handbook, full pagewidth RF 1st IF filter(1) 2nd IF filter(1) RFI 42 BPFI 40 MX1O 39 MX2I 36 MX2O 37 LIMI 34 IF limiter PLLO 32 DETO 31 LNA x 1st mixer x 2nd mixer x LOOP FILTER VCO DUAL PLL FREQUENCY SYNTHESIZER RX VCO 47 RXPD LPF 43 RXLF 45 LO1O 44 LO1I CRYSTAL OSCILLATOR 24 LO2I 23 LO2O 35 RSSI amplifier RSSI Vref carrier detect output FCA121 crystal (1) (1) Values depend on the country application (see definition in Chapter "Channel frequencies"). Fig.3 FM receiver schematic diagram. 2000 Aug 10 7 Philips Semiconductors Product specification Analog cordless telephone IC DATA COMPARATOR The data comparator is an inverting hysteresis comparator. An external filter is connected between pins DETO and DATI (AC-coupled). The open-collector output is current limited to control the output signal slew rate. The external resistor at pin DATO, connected to VCC, should be 220 k. An external capacitor in parallel with this resistor will reduce the slew rate. The transmit part The transmitter architecture is of the direct modulation type. The transmit VCO can be frequency modulated either by speech or data (see Fig.4). TRANSMIT VCO UAA2062 Before the VCO, an amplifier sums the modulating signal and the data TX signal. The Colpitts type transmit VCO includes integrated varicaps. Fixed external capacitors are used to extend the tuning range for all countries. The internal capacitors are programmed via the serial bus interface. The power amplifier is capable of driving 50 AC. The output level is also programmed with 2 bits via the serial bus interface. An internal regulator supplies the TX VCO. handbook, full pagewidth data TX TXO 6 MODI 5 MODO 4 VB VCC(AUTX) 15 10 VREFTX VBMOD summing amplifier 10.24 MHz REG 3 V TX VCO PA 7 PAO TXPD 2 DUAL PLL FREQUENCY SYNTHESIZER LPF TXLF 3 9 LO3I FCA122 Fig.4 Transmit schematic diagram. 2000 Aug 10 8 Philips Semiconductors Product specification Analog cordless telephone IC The synthesizer The synthesizer has been designed to support most country channel frequencies between 25 and 50 MHz (see Chapter "Channel frequencies"). The local oscillator LO2 and the reference divider provide the reference frequency for the RX and TX PLL loops. A single bit programmes the divider value for the reference divider. A 5 kHz reference frequency (respectively 12.5 kHz) is used with a 10.24 MHz crystal frequency (respectively 11.15 MHz). The clock divider ratio can be programmed to 2.5 or to 80. The ratio 80 can be chosen when the IC is in sleep mode to obtain current saving in the microcontroller. The clock output is a CMOS output inverter, supplied by Vref(PLL). The 14-bit TX counter is programmed for the desired transmit channel frequency. The 14-bit RX counter is programmed for the desired RX VCO frequency. UAA2062 All counters power-up in the proper default state and for a 10.24 MHz reference crystal. Both RX and TX phase detectors have current drive type outputs of 400 A. The RX VCO is connected to an external capacitor and inductor as illustrated in Fig.5. The varicaps are integrated. Operating in the 25 US channels, there is a large frequency difference between the minimum and the maximum channel frequencies. The sensitivity of the RX VCO is not large enough to accommodate this large frequency range. Internal programmable capacitors can be connected across the RX VCO tank circuit to change the RX VCO sensitivity. The TX VCO also has internal programmable capacitors to accommodate a large frequency range. Chapter "Channel frequencies" shows the frequency selection for all countries. andbook, full pagewidth CLKO 22 CLOCK DIVIDER 1-BIT PROGRAMMABLE REFERENCE COUNTER /2048 or /892 crystal oscillator 24 LO2I 23 LO2O 9 LO3I 14-BIT PROGRAMMABLE RX COUNTER RX PHASE DETECTOR C1 R2 RXPD 47 TX PHASE DETECTOR 14-BIT PROGRAMMABLE TX COUNTER TX VCO 3 TXLF C6 R6 R5 2 TXPD C5 C2 R3 43 C3 RXLF 44 LO1I RX VCO 45 LO1O C4 FCA123 Fig.5 Synthesizer schematic diagram. 2000 Aug 10 9 Philips Semiconductors Product specification Analog cordless telephone IC The RX baseband This section covers the RX audio path from pins RXI to EARO. The RXI input signal is AC-coupled. The microcontroller sets the value of the RX gain by 32 linear steps of 0.5 dB. The RX baseband has a mute and an expander with the characteristics shown in Fig.7. EARPIECE AMPLIFIER UAA2062 The earpiece amplifier is an inverting rail-to-rail operational amplifier. The non-inverting input is connected to the internal reference voltage VB. Internal resistors are used to set the gain at 6 dB. An external resistor (connected between pins EARI and EARO) can be used to reduce the gain. handbook, full pagewidth ECAP 1 RXI 30 EARI 26 earpiece amplifier EARO 27 RX gain RX mute expander internal resistor : 28 k external resistor FCA124 Fig.6 RX baseband schematic diagram. handbook, full pagewidth EARO (dBV) 0 FCA127 EARO = -7 dBV typical at THD = 5% -10 -20 -20 -30 -40 -40 -50 -60 -40 -30 -20 -10 0 RXI (dBV) (1) GARX = 0 dB, GEAR = 0 dB (external resistor of 28 k). Fig.7 Expander characteristic. 2000 Aug 10 10 Philips Semiconductors Product specification Analog cordless telephone IC The TX baseband This section covers the TX audio path from pins MICI to TXO. The microphone amplifier is an inverting operational amplifier whose gain can be set by external resistors. The input signal at pin MICI and the output signal at pin MOCO are both AC-coupled. The non-inverting input is connected to the internal reference voltage VB. External resistors are used to set the gain and frequency response. UAA2062 The TX baseband has a compressor with the characteristic shown in Fig.9. The Automatic Level Control (ALC) provides a `soft' limit to the output signal swing as the input voltage increases slowly (i.e. a sine wave is maintained at the output). A hard limiter clamps the compressor output voltage at 1.26 V (p-p). The ALC and the hard limiter can be disabled via the microcontroller interface. The hard limiter is followed by a mute circuit. The TX gain is digitally programmable in 32 steps of 0.5 dB. handbook, full pagewidth CCAP 11 ALC MICI 14 MICO 13 CMPI 12 TXO 6 FCA125 microphone amplifier compressor hard limiter TX mute TX gain Fig.8 TX baseband schematic diagram. handbook, full pagewidth TXO (dBV) 0 -10 -20 -30 -40 VCMPI = -4 dBV; VTXO = -1.26 V(p-p) (hard limiting signals) -20 VCMPI = -2.5 dBV VTXO = -11.5 dBV VCMPI = -16 dBV; VTXO = -13 dBV -30 (slowly changing ALC signals) -60 -50 -40 -30 -20 -10 CMPI (dBV) 0 FCA126 Fig.9 Compressor characteristic. 2000 Aug 10 11 Philips Semiconductors Product specification Analog cordless telephone IC Other features PLL VOLTAGE REGULATOR Pin Vref(PLL) provides the internal supply voltage for the RX and TX PLLs. It is regulated at 3 V. Pin VCC(AU) provides the supply voltage input for the internal voltage regulator. Two capacitors of 47 F and 100 nF must be connected to pin Vref(PLL) to filter and stabilize this regulated voltage. The tolerance of the regulated voltage is initially 8% but is improved to 4% after the internal band gap voltage reference is adjusted via the microcontroller. The voltage regulator is always turned on. In the inactive mode the calibration is turned off to reduce current consumption. In this mode, the Vref(PLL) block supplies 300 A to the microcontroller. The output drive capability is 3 mA. The voltage regulator is able to supply the microcontroller. The local oscillator LO2 and the RX and TX phase detectors are powered by the internal voltage regulator at pin Vref(PLL). Therefore, the maximum input and output level for most I/O pins (LO2I and LO2O) equals the regulated voltage at pin Vref(PLL). LOW-BATTERY DETECTOR The low-battery detector measures the voltage level of the VCC(AU) using a resistance divider and a comparator. One input of the comparator is connected to VB, the other to the middle point of the resistance divider. UAA2062 The comparator has a built-in hysteresis to prevent spurious switching. The precision of the detection depends on the divider accuracy, the comparator offset and the accuracy of the reference voltage VB. The output is multiplexed at pin CDBDO. When the battery voltage level is below the threshold voltage the output CDBDO is going LOW. Microcontroller serial interface Pins DATA, CLK and EN provide a 3-wire unidirectional serial interface for programming the reference counters, the transmit and receive channel divider counters and the control functions. The interface consists of 18-bit shift registers connected to a matrix of registers organized as 6 words of 18 bits. The leading 15 bits include the data D14 to D0. The trailing 3 bits set up the address AD2 to AD0. The data is entered with the most significant bit D14 first. The last bit is bit AD0. Pins DATA and CLK are used to load data into the shift register. Figure 10 shows the timing required on all pins. Data is clocked into the shift registers on negative clock transitions. The serial interface pins DATA, CLK and EN, are supplied by Vref(PLL). Internal level shifters are provided after the pins which allow the logic and registers to be internally powered by VCC(AU). The ESD protection diodes on these pins are connected to VCC(AU). All the digital outputs (CDBDO and DATO) are open-collector outputs. handbook, full pagewidth data bits (15) address bits (3) DATA D14 tSU;DC D13 D12 AD1 AD0 CLK 50% tHD;EC tSU;CE 50% tEND tw EN 50% data bits latched MGR004 Fig.10 Digital signals timing requirement. 2000 Aug 10 12 Philips Semiconductors Product specification Analog cordless telephone IC DATA REGISTERS AND ADDRESSES UAA2062 Table 3 shows the data latches and addresses which are used to select each of the registers. bit D14 is the MSB and is written and loaded first. Table 3 ADDR 001 010 011 100 101 Data register and addresses D14 - - voltage reference adjust [2 to 0] test modes [2 to 0](1) BD active Clk Div [1 and 0] Ref Div IP3 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 TX counter [13 to 0] RX counter [13 to 0] LNA gain [1 and 0] LNA RIN [1 and 0] VREFPLL HLim disable - LNA capacitor [3 to 0] RX VCO capacitor [3 to 0] RX mute FM PLL centre frequency shift [3 to 0] RX gain control[4 to 0] low-battery detector threshold [2 to 0] PA [1 and 0] CD threshold control [4 to 0] 110 Note active modes [1 and 0] TX VCO capacitor selection[3 to 0] ALC TX disable mute TX gain control[4 to 0] 1. The three bits must be set at 000 in normal operation. Table 4 ADDR 001 010 011 100 101 110 Data register default value D14 - - 0 0 0 0 D13 1 0 1 0 0 0 D12 0 1 1 0 0 1 D11 0 1 0 0 0 1 D10 1 1 1 0 0 0 D9 1 0 0 0 0 1 D8 0 0 0 0 0 1 D7 1 0 0 0 0 1 D6 1 0 0 0 0 0 D5 1 1 0 0 0 0 D4 0 0 0 0 0 0 D3 1 1 0 0 1 1 D2 1 1 1 1 1 1 D1 1 1 - 1 1 1 D0 0 1 - 1 1 1 ACTIVE MODES BITS SELECTION Table 5 Active modes bits selection BIT 1 0 0 1 1 BIT 0 0 1 0 1 RX mode standby mode inactive mode DESCRIPTION active mode 2000 Aug 10 13 Philips Semiconductors Product specification Analog cordless telephone IC REGISTER CONTENT DESCRIPTION Table 6 Register content description BIT 1 0 ALC disable HLim RX mute TX mute LBD enable VREFPLL disable Ref Div 1 0 1 0 1 0 1 0 1 0 1 0 1 0 DESCRIPTION IP3 HIGH mode for 2nd mixer IP3 LOW mode for 2nd mixer automatic level control disabled normal operation hard limiter disabled normal operation RX channel muted normal operation TX channel muted normal operation low-battery detector enabled carrier detector enabled VREFPLL disabled (tied to VCC) VREFPLL enabled UAA2062 DATA REGISTER IP3 divider ratio 892 (conversion from 11.15 MHz to 12.5 kHz) divider ratio 2048 (conversion from 10.24 MHz to 5 kHz) 2000 Aug 10 14 Philips Semiconductors Product specification Analog cordless telephone IC TX AND RX GAIN SELECTION UAA2062 The TX and RX audio signal paths have a programmable gain block. If a TX or RX voltage gain other than the nominal power-up default is desired it can be programmed via the microcontroller interface. The gain blocks can be used during final test of the telephone to electronically adjust for gain tolerances in the telephone system. The RX gain and the TX gain selection covers a dynamic range from -7.5 to +8 dB in steps of 0.5 dB and can be programmed independently from each other. Table 7 TX and RX gain selection BIT 3 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 BIT 2 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 BIT 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 BIT 0 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 STEP 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 TX GAIN (dB) -7.5 -7.0 -6.5 -6.0 -5.5 -5.0 -4.5 -4.0 -3.5 -3.0 -2.5 -2.0 -1.5 -1.0 -0.5 0 +0.5 +1.0 +1.5 +2.0 +2.5 +3.0 +3.5 +4.0 +4.5 +5.0 +5.5 +6.0 +6.5 +7.0 +7.5 +8.0 RX GAIN (dB) -7.5 -7.0 -6.5 -6.0 -5.5 -5.0 -4.5 -4.0 -3.5 -3.0 -2.5 -2.0 -1.5 -1.0 -0.5 0 +0.5 +1.0 +1.5 +2.0 +2.5 +3.0 +3.5 +4.0 +4.5 +5.0 +5.5 +6.0 +6.5 +7.0 +7.5 +8.0 BIT 4 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 2000 Aug 10 15 Philips Semiconductors Product specification Analog cordless telephone IC CARRIER DETECTOR THRESHOLD SELECTION UAA2062 The carrier detector indicates if a carrier signal is present on the selected channel. The nominal value and tolerance of the carrier detector threshold is given in the carrier detector specification section. If a different carrier detector threshold value is desired, it can be selected via the microcontroller interface. If it is required to scale the carrier detector range, an external resistor should be connected between pin RSSI and ground. The carrier detector threshold step 19 (10011) corresponds to a typical level on pin RSSI of 0.86 V DC. Table 8 BIT 4 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 Carrier detector threshold selection BIT 3 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 BIT 2 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 BIT 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 BIT 0 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 STEP 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 CARRIER DETECTOR THRESHOLD (V) 0.1 0.14 0.18 0.22 0.26 0.3 0.34 0.38 0.42 0.46 0.5 0.54 0.58 0.62 0.66 0.7 0.74 0.78 0.82 0.86 0.9 0.94 0.98 1.02 1.06 1.1 1.14 1.18 1.22 1.26 1.3 1.34 2000 Aug 10 16 Philips Semiconductors Product specification Analog cordless telephone IC LOW-BATTERY DETECTOR LEVEL SELECTION UAA2062 When the LBD register is set HIGH, the low-battery detector is enabled and the low-battery detect output signal is routed to the output pin CDBDO. The low-battery detector level selection functions only in a programmable mode. The power-up default value is step 7 (111). Table 9 Low-battery detector level selection NOMINAL LOW-BATTERY DETECTOR VOLTAGE (V) 3.6 3.5 3.4 3.3 3.2 3.1 3.0 2.9 BIT 2 BIT 1 BIT 0 STEP 0 0 0 0 1 1 1 1 VOLTAGE REFERENCE SELECTION 0 0 1 1 0 0 1 1 0 1 0 1 0 1 0 1 0 1 2 3 4 5 6 7 An internal 1.5 V band gap reference voltage provides the voltage reference for the low-battery detector circuit, the Vref(PLL) voltage regulator, the VB reference and all internal analog references. Table 10 Voltage reference selection BIT 2 0 0 0 0 1 1 1 1 BIT 1 0 0 1 1 0 0 1 1 BIT 0 0 1 0 1 0 1 0 1 STEP 0 1 2 3 4 5 6 7 NOMINAL VOLTAGE REFERENCE (%) -7 -5 -3 -1 +1 +3 +5 +7 2000 Aug 10 17 Philips Semiconductors Product specification Analog cordless telephone IC LNA CAPACITOR SELECTION UAA2062 The LNA has an external capacitor and inductor that together form a band-pass filter. A programmable on-chip capacitor is integrated which gives, in parallel with an external L and C, the possibility to tune the band-pass filter characteristic during production. A parasitic capacitor has to be added to the internal capacitor value. Table 11 LNA capacitor selection BIT 3 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 BIT 2 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 BIT 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 BIT 0 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 STEP 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 LNA CAPACITOR VALUE (pF) 0 0.8 1.6 2.4 3.2 4.0 4.8 5.6 6.4 7.2 8.0 8.8 9.6 10.4 11.2 12.0 2000 Aug 10 18 Philips Semiconductors Product specification Analog cordless telephone IC LNA GAIN SELECTION UAA2062 The LNA has an internal programmable voltage conversion gain. This allows to tune the gain in order to achieve the best compromise in term of performance. The LNA gain is given with a reference value of L = 390 nH (Qloaded = 40) at 50 MHz. Table 12 LNA gain selection; L = 390 nH at BPFI; QLoaded = 40; f = 50 MHz BIT 1 0 0 1 1 LNA INPUT RESISTIVE IMPEDANCE SELECTION The LNA has an internal programmable input resistive impedance (RIN) in order to improve the duplexer and LNA performance. To calculate the input resistive impedance we must know the typical LNA gain (i.e. the value of the external inductance and its Q). A small capacitance at the LNA input is needed to improve matching between LNA and duplexer. The programmability of tuning the input impedance allows to obtain an optimum sensitivity performance in the active and in the RX mode of operation. Table 13 LNA input resistive impedance selection TYPICAL LNA INPUT RESISTIVE IMPEDANCE BIT 1 0 0 1 1 BIT 0 0 1 0 1 STEP 0 1 2 3 LNA VOLTAGE GAIN = 17 dB 1.2 k 3.0 k 7.1 k 22.9 k LNA VOLTAGE GAIN = 23 dB 645 1.6 k 3.8 k 14.5 k BIT 0 0 1 0 1 STEP 0 1 2 3 LNA GAIN (dB) 17 19 21 23 2000 Aug 10 19 Philips Semiconductors Product specification Analog cordless telephone IC RX AND TX VCO CAPACITOR SELECTION UAA2062 The RX VCO and the TX VCO have an external LC tank circuit. A programmable internal capacitor is integrated in parallel with the external L and C in order to tune the VCO and to keep the PLL in lock for large frequency steps. A parasitic capacitor has to be added to these values. The RX VCO capacitor value and the TX VCO capacitor value can be programmed independently one from the other. Table 14 RX and TX VCO capacitor selection INTERNAL RX VCO CAPACITOR VALUE (pF) 0 0.9 1.8 2.7 3.6 4.5 5.4 6.3 7.2 8.1 9.0 9.9 10.8 11.7 12.6 13.5 INTERNAL TX VCO CAPACITOR VALUE (pF) 0 0.45 0.9 1.35 1.8 2.25 2.7 3.15 3.6 4.05 4.5 4.95 5.4 5.85 6.3 6.75 BIT 3 BIT 2 BIT 1 BIT 0 STEP 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 PA OUTPUT LEVEL SELECTION The power amplifier has 2 bits to select the output voltage level. The power-up default value is step 3 (11). VCC = 3.6 V. Table 15 PA output level selection BIT 1 0 0 1 1 BIT 0 0 1 0 1 STEP 0 1 2 3 PA OUTPUT POWER (dB) -4 -2 0 +2 2000 Aug 10 20 Philips Semiconductors Product specification Analog cordless telephone IC FM PLL CENTRE FREQUENCY SHIFT SELECTION UAA2062 This programming enables to shift the centre frequency of the VCO, within the FM PLL, in order to align the frequency as close as possible to the 2nd IF frequency (nominal frequency 455 kHz). Table 16 FM PLL centre frequency shift selection BIT 3 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 BIT 2 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 BIT 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 BIT 0 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 STEP 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 CENTRE FREQUENCY SHIFT (kHz) -154 -132 -110 -88 -66 -44 -22 0 +22 +44 +66 +88 +110 +132 +154 +176 CLOCK DIVIDER RATIO SELECTION The clock output signal CLKO is derived from the local oscillator LO2 and can be used to drive a microcontroller. The LO2 signal is divided with a programmable divider value. The divider is followed by a filter that controls the slew rate of the signal in order to avoid radiation noise on the PCB. The CLKO output also has the option to disable the output signal. The default value is step 1 (01). Table 17 Clock divider ratio selection BIT 1 0 0 1 BIT 0 0 1 0 STEP 0 1 2 CLOCK DIVIDER RATIO output disabled 2.5 80 2000 Aug 10 21 Philips Semiconductors Product specification Analog cordless telephone IC LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL VCC Tstg Tamb HANDLING supply voltage storage temperature ambient temperature PARAMETER -0.3 -55 -10 MIN. MAX. +6.0 +125 +70 UAA2062 UNIT V C C Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is desirable to take normal precautions appropriate to handling MOS devices. THERMAL CHARACTERISTICS SYMBOL Rth(j-a) PARAMETER thermal resistance from junction to ambient CONDITIONS in free air VALUE 100 UNIT K/W CHARACTERISTICS VCC = 3.6 V; Tamb = 25 C; specified for US handset applications; unless otherwise specified. SYMBOL Supply VCC Tamb supply voltage ambient temperature 3 -10 3.6 - 5.25 +70 V C PARAMETER CONDITIONS MIN. TYP. MAX. UNIT FM receiver part GENERAL FM RECEIVER SYSTEM CHARACTERISTICS; note 1 SRFI sensitivity at duplexer input (50 ) matched duplexer (3 dB loss) for 20 dB SINAD for 12 dB SINAD RX mode for 12 dB SINAD active mode THDFM VDETO(rms) S/NFM total harmonic distortion AC output level at pin DETO (RMS value) signal-to-noise ratio without CCITT filter Vi(RFI) = -65 dBm Vi(RFI) = -65 dBm - - - - - - -112 -117 -116 2.0 100 45 - - - 3.0 - - dBm dBm dBm % mV dB 2000 Aug 10 22 Philips Semiconductors Product specification Analog cordless telephone IC UAA2062 SYMBOL PARAMETER CONDITIONS - MIN. TYP. - MAX. UNIT LOW-NOISE AMPLIFIER; note 2 Gv(LNA) voltage conversion gain from pin RFI to pin BPFI; LNA gain step 2; LNA RIN step 3 from pin RFI to pin BPFI from pin RFI to pin BPFI referenced to pin RFI from pin RFI to pin BPFI; LNA gain step 2; LNA RIN step 3 21 dB Gv(LNA) Nsteps(LNA) Vi(LNA) CP1LNA(rms) FLNA voltage conversion gain adjustment range voltage conversion gain adjust steps input voltage 1 dB compression point (RMS value) noise figure - - -125 - - 6 4 - 35 3 - - -10 - - dB dBm mV dB 1ST MIXER; note 3 Zo(MX1) Gcp(MX1) IP3MX1(rms) CP1MX1(rms) FMX1 Zi(MX2) Zo(MX2) Gcp(MX2) output impedance voltage conversion gain 3rd-order intercept point (RMS value) 1 dB compression point (RMS value) input referenced noise referenced to pin BPFI - ZL = 330 ; - referenced to pin BPFI referenced to pin BPFI - referenced to pin BPFI - referenced to pin BPFI - - - measured at pin MX2O IP3 HIGH IP3 LOW NFMX2 IP3MX2(rms) noise figure from pin MX2I to pin MX2O 3rd order intercept (RMS value) measured at pin MX2O; referenced to pin MX2I IP3 HIGH IP3 LOW - - 210 150 - - mV mV - - - 15 18 15 - - 18 dB dB dB 330 11.5 260 100 12 - - - - - - - dB mV mV nV/Hz 2ND MIXER; note 4 input impedance output impedance voltage conversion gain 1.5 1.5 k k 2000 Aug 10 23 Philips Semiconductors Product specification Analog cordless telephone IC UAA2062 SYMBOL CP1MX2(rms) PARAMETER 1 dB compression point (RMS value) CONDITIONS measured at pin MX2O; referenced to pin MX2I IP3 HIGH IP3 LOW - - - MIN. TYP. MAX. UNIT 70 50 - - - - mV mV LIMITER Zi(LIM) Gv(LIM) input impedance voltage gain f0 = 455 kHz 1.5 85 k dB f0 = 455 kHz; - Vi(LIM) = 100 V (RMS) after calibration free running; open loop - 200 - - 5 RL(PLL) = 5 k - PLL DEMODULATOR; note 5 fVCO/V fVCO Nstep(VCO) fVCO(st) RL(PLL) Vo(PLL)(rms) VCO gain VCO centre frequency number of steps for VCO frequency adjustment VCO centre frequency step demodulator external load on pin DETO output voltage on pin DETO (RMS value) 50 455 16 22 - - - 650 - - - 0.4 kHz k V kHz/V kHz RSSI CARRIER DETECTOR; note 6 RSSI VOH VOL Ri Vdet Vdet(st) Vhys Nstep(CD) output current dynamic range HIGH-level output voltage at CD step 19; pin CDBDO Vi(LIM) = 0.1 V (RMS) LOW-level output voltage at pin CDBDO internal resistance voltage detection voltage detection step hysteresis voltage number of steps for carrier sense threshold Vi(LIM) = 0 V (RMS); CD step 19 between pins RSSI and VCC(RF) - 0.9VCC - - 0.05 - - programmable through - microcontroller 65 - - 170 - 40 60 32 - - 0.1VCC - 1.3 - - - dB V V k V mV mV DATA COMPARATOR Vac(DATI)(p-p) Vth(DATI) AC input voltage (peak-to-peak value) threshold voltage on pin DATI 75 - - - mV V VCC - 0.9 - 2000 Aug 10 24 Philips Semiconductors Product specification Analog cordless telephone IC UAA2062 SYMBOL Zi(DATI) VOH(DATO) VOL(DATO) Io(sink) PARAMETER input impedance at pin DATI HIGH-level output voltage on pin DATO CONDITIONS - Vi(DATI) = VCC - 1.4 V MIN. 0.9VCC - - - - 20 TYP. 240 - - MAX. UNIT k V V A LOW-level output voltage on Vi(DATI) = VCC - 0.4 V pin DATO output sink current Vi(DATI) = VCC - 0.4 V; Vo(DATO) = 0.1VCC 0.1VCC - The transmit part; note 7 General THDTX total harmonic distortion after demodulation VMICI = 1 mV (RMS); CCITT filter (P53) - 2 - % Summing amplifier Vo(SUM) Rf(SUM) Vbias(SUM) VPA Nstep(PA) Vo(PA) H2PA H3PA f ------ (MODO) V f ------ (TXLF) V QL(VCO) NVCO(TX) summing amplifier output voltage on pin MODO summing amplifier external feedback resistor DC voltage at pin MODI between pins MODI and MODO - 10 - fo = 49.97 MHz; PA step 3 - - -4 14 26 VMODO = 2.4 V VTXLF = 0.9 V VTXLF = 1.2 V Q factor of external L filter TX VCO phase noise L = 330 nH fcarrier = 25 to 50 MHz foffset = 5 kHz foffset = 12.5 kHz The synthesizer PLL LOOP FILTER; note 9 fxtal Ci(LO2) LO frequency parasitic capacitance between pins LO2I and LO2O load capacitance between pins LO2I and LO2O - - - - 12 3 MHz pF - - -96 -104 -80 -87 dBc/Hz dBc/Hz - - - 40 -10 - 2.4 - - - - - +2 - - - - - - dB dB dB kHz/V kHz/V kHz/V dBV k V Voltage controlled oscillator and power amplifier; note 8 PA output voltage number of steps of VCO output voltage PA output voltage attenuation 2nd harmonic attenuation 3rd harmonic VCO modulation gain VCO gain 2 4 - 18 34 15.5 550 380 - dBm CL(LO2) - 15 30 pF 2000 Aug 10 25 Philips Semiconductors Product specification Analog cordless telephone IC UAA2062 SYMBOL fRX NVCO(RX) PARAMETER RX VCO frequency RX VCO phase noise at pin LO2O CONDITIONS 25 fcarrier = 25 to 37 MHz foffset = 5 kHz foffset = 12.5 kHz - - MIN. - TYP. MAX. 55 -90 -98 - UNIT MHz dBc/Hz dBc/Hz ms -96 -104 10 tstrt(RXPLL) RX PLL start time measured by switching - from inactive to active mode from channel 8 to channel 10; measured within 500 Hz from final frequency - tres(RXPLL) RX PLL step response time 12 - ms tstrt(TXPLL) TX PLL start time measured by switching - from inactive to active mode from CH 7 to CH 10; measured within 500 Hz from final frequency - 60 - ms tres(TXPLL) TX PLL step response time 40 - ms fTX Co(RXPD) Co(TXPD) TX VCO frequency output capacitance at pin RXPD output capacitance at pin TXPD 20 - - - - - 55 8 8 MHz pF pF The RX baseband RX AUDIO PATH; note 10 GARX Nstep(ARX) Gv(m) GEXP RX gain adjustment RX gain adjust steps RX mute expander gain level programmable through -7.5 microcontroller programmable through - microcontroller Vi(RXI) = -20 dBV Vi(RXI) = -20 dBV Vi(RXI) = -30 dBV Vi(RXI) = -40 dBV Zi(RXI) tatt(EXP) trel(EXP) ct(EARO) input impedance expander attack time expander release time compressor to expander crosstalk attenuation CECAP = 0.47 F CECAP = 0.47 F from pin CMPI to pin EARO; VRXI = 0 V (RMS); VCMPI = -20 dBV - -4 -14 - - - - - - 32 -70 0 -10 -20 15 3.0 13.5 70 +8 - -60 +4 -6 - - - - - dB dB dB dB k ms ms dB dB 2000 Aug 10 26 Philips Semiconductors Product specification Analog cordless telephone IC UAA2062 SYMBOL PARAMETER CONDITIONS - - - - - MIN. TYP. - - - 1 - MAX. UNIT EARPIECE AMPLIFIER; note 11 Vo(EARO)(p-p) Gear RL(EARO) THDARX NARX output swing voltage (peak-to-peak value) gain earpiece amplifier earpiece resistance total harmonic distortion audio path noise THD < 4% no external resistor note 12 Vi(RXI) = -20 dBV B = 400 Hz to 3 kHz 2.2 6 150 0.5 -83 V dB % dBV The TX baseband MICROPHONE AMPLIFIER; note 13 Vo(MICO) GV THDMICO output swing voltage gain adjustment total harmonic distortion f = 1 kHz; Vo(MICO) = -12 dBV ALC disabled Vi(CMPI) = -10 dBV Vi(CMPI) = -30 dBV Vi(CMPI) = -50 dBV GCOMP(max) VHLIM(p-p) maximum compressor gain output voltage hard limiter (peak-to-peak value) input voltage range output voltage ALC normal operation Vi(CMPI) = -12 dBV Vi(CMPI) = -10 dBV Vi(CMPI) = -2.5 dBV THDCOMP Zi(CMPI) tatt(COMP) trel(COMP) ct(COMP) total harmonic distortion input impedance compressor attack time compressor release time expander to compressor crosstalk attenuation TX mute TX gain adjustment TX gain adjustment steps CCCAP = 0.47 F CCCAP = 0.47 F Vi(CMPI) = 0 V (RMS); from RXI to TXO; Vi(RXI) = -10 dBV ALC disabled; Vi(CMPI) = -10 dBV ALC disabled; Vi(CMPI) = -10 dBV - - - - - - - - -12.5 -12.3 -11.5 0.5 15 3.0 13.5 40 - - - 1 - - - - dBV dBV dBV % k ms ms dB Vi(CMPI) = -70 dBV HLim disabled; ALC disabled; Vi(CMPI) = -4 dBV -4 6 16 - - 0 10 20 23 1.26 +4 14 24 - - dB dB dB dB V RL = 10 k - 0 - -27 - 0.2 -12 34 - dBV dB % TX AUDIO PATH; note 14 GCOMP compressor gain Vi(CMPI) Vo(TXO) - -26 -12 dBV Gv(m) GATX Nstep(ATX) - -70 - 32 -60 +8 - dB dB programmable through -7.5 microcontroller programmable through - microcontroller 2000 Aug 10 27 Philips Semiconductors Product specification Analog cordless telephone IC UAA2062 SYMBOL Zo(TXO) PARAMETER output impedance at pin TXO CONDITIONS - MIN. TYP. 500 - MAX. UNIT Other features PLL VOLTAGE REGULATOR Vref(PLL) Vref(PLL) Io VCC/VCC regulated output level load regulation output current before VB adjustment after VB adjustment VCC = 3.6 V; Io = 0 to 3 mA VCC = 3.6 V after VB adjustment; low-battery detect level step 0 2.75 2.95 - - -3 3 3 100 - - 3.25 3.05 - 3 V V mV mA LOW-BATTERY DETECTOR: LBD ENABLED battery detection accuracy +3 % Characteristics of digital pins MICROCONTROLLER VIL VIH IIL IIH Ci LOW-level input voltage at pins DATA, CLK and EN HIGH-level input voltage at pins DATA, CLK and EN LOW-level input current at pins DATA, CLK and EN HIGH-level input current at pins DATA, CLK and EN input capacitance at pins DATA, CLK and EN VIL = 0.3 V VIH = Vref(PLL) - 0.3 V - Vref(PLL) - 0.5 -5 - - - - - - - 0.5 VCC(AU) - 5 8 V V A A pF CDBDO OUTPUT IOL IOH VOL VOH LOW-level output current at pin CDBDO HIGH-level output current at pin CDBDO LOW-level output voltage at pin CDBDO RL = 100 k 0.7 - - 0.9VCC - - - - - -0.7 0.1VCC - mA mA V V HIGH-level output voltage at RL = 100 k pin CDBDO TIMING (see Fig.10) tSU;CE tSU;DC tHD;EC fclk tr tf set-up time CLK to EN set-up time DATA to CLK hold time EN to CLK clock frequency input rise time input fall time 10% to 90% 10% to 90% 50% of signals 50% of signals 50% of signals 200 200 200 - - - - - - - - - - - - 300 10 10 ns ns ns kHz ns ns 2000 Aug 10 28 Philips Semiconductors Product specification Analog cordless telephone IC UAA2062 SYMBOL tEND tW tstrt Notes PARAMETER hold time enable at the end of a word input pulse width at pin EN microcontroller interface start-up time CONDITIONS 100 note 15 90% of Vref(PLL) to DATA, CLK and EN MIN. - - - TYP. - - MAX. UNIT ns ns s 1/fCOMP - 200 1. f0 = 46.97 MHz; fdev = 1.5kHz; fmod = 1 kHz; LPF = 2.4 kHz at DETO; all with CCITT filter. 2. f0 = 46.97 MHz; L = 390 nH; Qloaded = 40; the input impedance and the gain of the LNA can be programmed individually (see Tables 12 and 13). 3. With 10.7 MHz filter load (input impedance 330 ); measured at pin MX1O. 4. fRF = 10.695 MHz; fLO = 10.24 MHz with 455 kHz ceramic filter load (input impedance 1500 ). 5. f0 = 455 kHz; fdev = 1.5kHz; fmod = 1 kHz. 6. VB = 1.5 V. 7. f0 = 49.97 MHz. 8. Voltage controlled oscillator: at pin LO3I, an inductance of 330 nH in parallel with a capacitor of 12 pF are connected to ground via a capacitor of 10 nF. Power amplifier: at PAO an inductance of 180 nH in parallel with a capacitor of 27 pF. The PAO is AC-coupled to the duplexer with a capacitor of 100 pF to filter the 2nd and 3rd harmonic. 9. PLL loop (see Fig.5): values for the RX loop filter components: C1 = 6.8 nF; C2 = 68 nF; C3 = 1.5 nF; R2 = 22 k; R3 = 47 k; values for the TX loop filter components: C4 = 15 nF; C5 = 150 nF; C6 = 3.9 nF; R5 = 22 k; R6 = 47 k. 10. RX gain adjust, RX mute and expander (see Fig.6): VB = 1.5 V; f = 1 kHz; RX gain step 15. 11. VB = 1.5 V; f = 1 kHz; no external feedback resistor; RL = 150 in series with 10 F. 12. For stable amplifier operation. 13. VB = 1.5 V; f = 1 kHz. Gain can be adjusted with external resistors. 14. Compressor, ALC/TX mute, TX gain adjust (see Fig.8): VB = 1.5 V; f = 1 kHz; TX gain step 15. 15. The minimum pulse width should be equal to the period of the comparison frequency, depending on the country. 2000 Aug 10 29 Philips Semiconductors Product specification Analog cordless telephone IC CHANNEL FREQUENCIES France: CT0 base set and handset channel frequencies Crystal frequency = 11.15 MHz; reference divider = 892; fref = 12.5 kHz; 1st IF = 10.7 MHz. BASE SET CHANNEL NUMBER TX CHANNEL FREQ (MHz) 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 26.3125 26.3250 26.3375 26.3500 26.3625 26.3750 26.3875 26.4000 26.4125 26.4250 26.4375 26.4500 26.4625 26.4750 26.4875 TX DIVIDER 2105 2106 2107 2108 2109 2110 2111 2112 2113 2114 2115 2116 2117 2118 2119 LO1 FREQ (MHz) 30.6125 30.6250 30.6375 30.6500 30.6625 30.6750 30.6875 30.7000 30.7125 30.7250 30.7375 30.7500 30.7625 30.7750 30.7875 RX TX CHANNEL DIVIDER FREQ (MHz) 2449 2450 2451 2452 2453 2454 2455 2456 2457 2458 2459 2460 2461 2462 2463 41.3125 41.3250 41.3375 41.3500 41.3625 41.3750 41.3875 41.4000 41.4125 41.4250 41.4375 41.4500 41.4625 41.4750 41.4875 HANDSET TX DIVIDER 3305 3306 3307 3308 3309 3310 3311 3312 3313 3314 3315 3316 3317 3318 3319 UAA2062 LO1 FREQ (MHz) 37.0125 37.0250 37.0375 37.0500 37.0625 37.0750 37.0875 37.1000 37.1125 37.1250 37.1375 37.1500 37.1625 37.1750 37.1875 RX DIVIDER 2961 2962 2963 2964 2965 2966 2967 2968 2969 2970 2971 2972 2973 2974 2975 Australia: CT0 base set and handset channel frequencies Crystal frequency = 11.15 MHz; reference divider = 892; fref = 12.5 kHz; 1st IF = 10.7 MHz. BASE SET CHANNEL NUMBER 1 2 3 4 5 6 7 8 9 10 TX CHANNEL FREQ (MHz) 30.075 30.125 30.175 30.225 30.275 30.100 30.150 30.200 30.250 30.300 TX DIVIDER 2406 2410 2414 2418 2422 2408 2412 2416 2420 2424 LO1 FREQ (MHz) 29.075 29.125 29.175 29.225 29.275 29.100 29.150 29.200 29.250 29.300 RX TX CHANNEL DIVIDER FREQ (MHz) 2326 2330 2334 2338 2342 2328 2332 2336 2340 2344 39.775 39.825 39.875 39.925 39.975 39.800 39.850 39.900 39.950 40.000 HANDSET TX DIVIDER 3182 3186 3190 3194 3198 3184 3188 3192 3196 3200 LO1 FREQ (MHz) 40.775 40.825 40.875 40.925 40.975 40.800 40.850 40.900 40.950 41.000 RX DIVIDER 3262 3266 3270 3274 3278 3264 3268 3272 3276 3280 2000 Aug 10 30 Philips Semiconductors Product specification Analog cordless telephone IC Spain: CT0 base set and handset channel frequencies Crystal frequency = 11.15 MHz; reference divider = 892; fref = 12.5 kHz; 1st IF = 10.7 MHz. BASE SET CHANNEL NUMBER 1 2 3 4 5 6 7 8 9 10 11 12 TX CHANNEL FREQ (MHz) 31.025 31.050 31.075 31.100 31.125 31.150 31.175 31.200 31.250 31.275 31.300 31.325 TX DIVIDER 2482 2484 2486 2488 2490 2492 2494 2496 2500 2502 2504 2506 LO1 FREQ (MHz) 29.225 29.250 29.275 29.300 29.325 29.350 29.375 29.400 29.450 29.475 29.500 29.525 RX TX CHANNEL DIVIDER FREQ (MHz) 2338 2340 2342 2344 2346 2348 2350 2352 2356 2358 2360 2362 39.925 39.950 39.975 40.000 40.025 40.050 40.075 40.100 40.150 40.175 40.200 40.225 HANDSET TX DIVIDER 3194 3196 3198 3200 3202 3204 3206 3208 3212 3214 3216 3218 UAA2062 LO1 FREQ (MHz) 41.725 41.750 41.775 41.800 41.825 41.850 41.875 41.900 41.950 41.975 42.000 42.025 RX DIVIDER 3338 3340 3342 3344 3346 3348 3350 3352 3356 3358 3360 3362 Netherlands: CT0 base set and handset channel frequencies Crystal frequency = 11.15 MHz; reference divider = 892; fref = 12.5 kHz; 1st IF = 10.7 MHz. BASE SET CHANNEL NUMBER 1 2 3 4 5 6 7 8 9 10 11 12 TX CHANNEL FREQ (MHz) 31.0375 31.0625 31.0875 31.1125 31.1375 31.1625 31.1875 31.2125 31.2325 31.2625 31.2875 31.3125 TX DIVIDER 2483 2485 2487 2489 2491 2493 2495 2497 2499 2501 2503 2505 LO1 FREQ (MHz) 29.2375 29.2625 29.2875 29.3125 29.3375 29.3625 29.3875 29.4125 29.4375 29.4625 29.4875 29.5125 RX TX CHANNEL DIVIDER FREQ (MHz) 2339 2341 2343 2345 2347 2349 2351 2353 2355 2357 2359 2361 39.9375 39.9625 39.9875 40.0125 40.0375 40.0625 40.0875 40.1125 40.1375 40.1625 40.1875 40.2125 HANDSET TX DIVIDER 3195 3197 3199 3201 3203 3205 3207 3209 3211 3213 3215 3217 LO1 FREQ (MHz) 41.7375 41.7625 41.7875 41.8125 41.8375 41.8625 41.8875 41.9125 41.9375 41.9625 419875 42.0125 RX DIVIDER 3339 3341 3343 3345 3347 3349 3351 3353 3355 3357 3359 3361 2000 Aug 10 31 Philips Semiconductors Product specification Analog cordless telephone IC New Zealand: CT0 base set and handset channel frequencies Crystal frequency = 11.15 MHz; reference divider = 892; fref = 12.5 kHz; 1st IF = 10.7 MHz. BASE SET CHANNEL NUMBER 11 12 13 14 15 16 17 18 19 20 TX CHANNEL FREQ (MHz) 34.250 34.275 34.300 34.325 34.350 34.375 34.400 34.425 34.450 34.475 TX DIVIDER 2740 2742 2744 2746 2748 2750 2752 2754 2756 2758 LO1 FREQ (MHz) 29.550 29.575 29.600 29.625 29.650 29.675 29.700 29.725 29.750 29.775 RX TX CHANNEL DIVIDER FREQ (MHz) 2364 2366 2368 2370 2372 2374 2376 2378 2380 2382 40.250 40.275 40.300 40.325 40.350 40.375 40.400 40.425 40.450 40.475 HANDSET TX DIVIDER 3220 3222 3224 3226 3228 3230 3232 3234 3236 3238 UAA2062 LO1 FREQ (MHz) 44.950 44.975 45.000 45.025 45.050 45.075 45.100 45.125 45.150 45.175 RX DIVIDER 3596 3598 3600 3602 3604 3606 3608 3610 3612 3614 Korea: CT0 base set and handset channel frequencies Crystal frequency = 10.24 MHz; reference divider = 2048; fref = 5 kHz; 1st IF = 10.695 MHz. BASE SET CHANNEL NUMBER 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 TX CHANNEL FREQ (MHz) 46.610 46.630 46.670 46.710 46.730 46.770 46.830 46.870 46.930 46.970 46.510 46.530 46.550 46.570 46.590 TX DIVIDER 9322 9326 9334 9342 9346 9354 9366 9374 9386 9394 9302 9306 9310 9314 9318 LO1 FREQ (MHz) 38.970 39.145 39.160 39.070 39.175 39.130 39.190 39.230 39.290 39.270 38.995 39.010 39.025 39.040 39.055 RX TX CHANNEL DIVIDER FREQ (MHz)) 7794 7829 7832 7814 7835 7826 7838 7846 7858 7854 7799 7802 7805 7808 7811 49.670 49.845 49.860 49.770 49.875 49.830 49.890 49.930 49.990 49.970 49.695 49.710 49.725 49.740 49.755 HANDSET TX DIVIDER 9934 9969 9972 9954 9975 9966 9978 9986 9998 9994 9939 9942 9945 9948 9951 LO1 FREQ (MHz) 35.910 35.930 35.970 36.010 36.030 36.070 36.130 36.170 36.230 36.270 35.810 35.830 35.850 35.870 35.890 RX DIVIDER 7182 7186 7194 7202 7206 7214 7226 7234 7246 7254 7162 7166 7170 7174 7178 2000 Aug 10 32 Philips Semiconductors Product specification Analog cordless telephone IC USA: CT0 base set and handset channel frequencies Crystal frequency = 10.24 MHz; reference divider = 24848048; fref = 5 kHz; 1st IF = 10.695 MHz. BASE SET CHANNEL NUMBER 1 2 3 4 5 6 7 8 9 10 New channels 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 43.720 43.740 43.820 43.840 43.920 43.960 44.120 44.160 44.180 44.200 44.320 44.360 44.400 44.460 44.480 8744 8748 8764 8768 8784 8792 8824 8832 8836 8840 8864 8872 8880 8892 8896 38.065 38.145 38.165 38.225 38.325 38.385 38.405 38.465 38.505 38.545 38.585 38.665 38.705 38.765 38.805 7613 7629 7633 7645 7665 7677 7681 7693 7701 7709 7717 7733 7741 7753 7761 48.760 48.840 48.860 48.920 49.020 49.080 49.100 49.160 49.200 49.240 49.280 49.360 49.400 49.460 49.500 9752 9768 9772 9784 9804 9816 9820 9832 9840 9848 9856 9872 9880 9892 9900 TX CHANNEL FREQ (MHz) 46.610 46.630 46.670 46.710 46.730 46.770 46.830 46.870 46.930 46.970 TX DIVIDER 9322 9326 9334 9342 9346 9354 9366 9374 9386 9394 LO1 FREQ (MHz) 38.975 39.150 39.165 39.075 39.180 39.135 39.195 39.235 39.295 39.275 RX TX CHANNEL DIVIDER FREQ (MHz) 7795 7830 7833 7815 7836 7827 7839 7847 7859 7855 49.670 49.845 49.860 49.770 49.875 49.830 49.890 49.930 49.990 49.970 HANDSET TX DIVIDER 9934 9969 9972 9954 9975 9966 9978 9986 9998 9994 UAA2062 LO1 FREQ (MHz) 35.915 35.935 35.975 36.015 36.035 36.075 36.135 36.175 36.235 36.275 RX DIVIDER 7183 7187 7195 7203 7207 7215 7227 7235 7247 7255 33.025 33.045 33.125 33.145 33.225 33.265 33.425 33.465 33.485 33.505 33.625 33.665 33.705 33.765 33.785 6605 6609 6625 6629 6645 6653 6685 6693 6697 6701 6725 6733 6741 6753 6757 2000 Aug 10 33 Philips Semiconductors Product specification Analog cordless telephone IC China: CT0 base set and handset channel frequencies Crystal frequency = 10.24 MHz; reference divider = 2048; fref = 5 kHz; 1st IF = 10.695 MHz. BASE SET CHANNEL NUMBER 1 2 3 4 5 6 7 8 9 10 TX CHANNEL FREQ (MHz) 45.250 45.275 45.300 45.325 45.350 45.375 45.400 45.425 45.450 45.475 TX DIVIDER 9050 9055 9060 9065 9070 9075 9080 9085 9090 9095 LO1 FREQ (MHz) 37.550 37.575 37.600 37.625 37.650 37.675 37.700 37.725 37.750 37.775 RX DIVIDER 7510 7515 7520 7525 7530 7535 7540 7545 7550 7555 TX CHANNEL FREQ (MHz) 48.250 48.275 48.300 48.325 48.350 48.375 48.400 48.425 48.450 48.475 HANDSET TX DIVIDER 9650 9655 9660 9665 9670 9675 9680 9685 9690 9695 UAA2062 LO1 FREQ (MHz) 34.550 34.575 34.600 34.625 34.650 34.675 34.700 34.725 34.750 34.775 RX DIVIDER 6910 6915 6920 6925 6930 6935 6940 6945 6950 6955 2000 Aug 10 34 Philips Semiconductors Product specification Analog cordless telephone IC PACKAGE OUTLINE SSOP48: plastic shrink small outline package; 48 leads; body width 7.5 mm UAA2062 SOT370-1 D E A X c y HE vM A Z 48 25 Q A2 A1 (A 3) Lp 1 bp 24 wM L detail X A pin 1 index e 0 5 scale 10 mm DIMENSIONS (mm are the original dimensions) UNIT mm A max. 2.8 A1 0.4 0.2 A2 2.35 2.20 A3 0.25 bp 0.3 0.2 c 0.22 0.13 D (1) 16.00 15.75 E (1) 7.6 7.4 e 0.635 HE 10.4 10.1 L 1.4 Lp 1.0 0.6 Q 1.2 1.0 v 0.25 w 0.18 y 0.1 Z (1) 0.85 0.40 8 0o o Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT370-1 REFERENCES IEC JEDEC MO-118 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-02-04 99-12-27 2000 Aug 10 35 Philips Semiconductors Product specification Analog cordless telephone IC SOLDERING Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used. Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should preferable be kept below 230 C. Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results: UAA2062 * Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Manual soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C. 2000 Aug 10 36 Philips Semiconductors Product specification Analog cordless telephone IC Suitability of surface mount IC packages for wave and reflow soldering methods SOLDERING METHOD PACKAGE WAVE BGA, SQFP PLCC(3), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO Notes not suitable suitable(2) recommended(3)(4) recommended(5) suitable not not suitable suitable suitable suitable suitable HLQFP, HSQFP, HSOP, HTSSOP, SMS not UAA2062 REFLOW(1) 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. 2000 Aug 10 37 Philips Semiconductors Product specification Analog cordless telephone IC DATA SHEET STATUS DATA SHEET STATUS Objective specification PRODUCT STATUS Development DEFINITIONS (1) UAA2062 This data sheet contains the design target or goal specifications for product development. Specification may change in any manner without notice. This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. This data sheet contains final specifications. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. Preliminary specification Qualification Product specification Production Note 1. Please consult the most recently issued data sheet before initiating or completing a design. DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. DISCLAIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. 2000 Aug 10 38 Philips Semiconductors Product specification Analog cordless telephone IC NOTES UAA2062 2000 Aug 10 39 Philips Semiconductors - a worldwide company Argentina: see South America Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140, Tel. +61 2 9704 8141, Fax. +61 2 9704 8139 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 1 60 101 1248, Fax. +43 1 60 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 68 9211, Fax. +359 2 68 9102 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381, Fax. +1 800 943 0087 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V, Tel. +45 33 29 3333, Fax. +45 33 29 3905 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +358 9 615 800, Fax. +358 9 6158 0920 France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex, Tel. +33 1 4099 6161, Fax. +33 1 4099 6427 Germany: Hammerbrookstrae 69, D-20097 HAMBURG, Tel. +49 40 2353 60, Fax. +49 40 2353 6300 Hungary: see Austria India: Philips INDIA Ltd, Band Box Building, 2nd floor, 254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025, Tel. +91 22 493 8541, Fax. +91 22 493 0966 Indonesia: PT Philips Development Corporation, Semiconductors Division, Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510, Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080 Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053, TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007 Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI), Tel. +39 039 203 6838, Fax +39 039 203 6800 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087 Middle East: see Italy Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Pakistan: see Singapore Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: Al.Jerozolimskie 195 B, 02-222 WARSAW, Tel. +48 22 5710 000, Fax. +48 22 5710 001 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 58088 Newville 2114, Tel. +27 11 471 5401, Fax. +27 11 471 5398 South America: Al. Vicente Pinzon, 173, 6th floor, 04547-130 SAO PAULO, SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 821 2382 Spain: Balmes 22, 08007 BARCELONA, Tel. +34 93 301 6312, Fax. +34 93 301 4107 Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 5985 2000, Fax. +46 8 5985 2745 Switzerland: Allmendstrasse 140, CH-8027 ZURICH, Tel. +41 1 488 2741 Fax. +41 1 488 3263 Taiwan: Philips Semiconductors, 5F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2451, Fax. +886 2 2134 2874 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 60/14 MOO 11, Bangna Trad Road KM. 3, Bagna, BANGKOK 10260, Tel. +66 2 361 7910, Fax. +66 2 398 3447 Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye, ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381, Fax. +1 800 943 0087 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 3341 299, Fax.+381 11 3342 553 For all other countries apply to: Philips Semiconductors, Marketing Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 2000 Internet: http://www.semiconductors.philips.com SCA 70 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 403506/01/pp40 Date of release: 2000 Aug 10 Document order number: 9397 750 06699 |
Price & Availability of UAA2062TS
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |